When Qualcomm released its Snapdragon 810 there were several reports about its overheating too easily, specially in the Sony Xperia Z3+/Z4. However, with these new flagships, Sony decided to give to the Snapdragon 810 another try but this time with a twiste to prevent the high temperatures.
According to a teardown posted to Weibo, Sony has opted to use a dual-pipe system in the Z5 and Z5 Premium to better dissipate heat from the processor to help it last longer before overheating.
The previous flagships only had one ‘pipe’ to do all this work in the processor. Obviously this was not enough and the overheating happens a lot of times. You can see the single copper ‘pipe’ clearly in the image below.
Below are images of the Z5 and Z5 Premium post-teardown showing the two copper strips used to pull heat away from the chipset.
There are another devices that were released recently with this problematic chipset but all with some change that helps to prevent the overheating problems. OnePlus launched the OnePlus 2 which also includes the Snapdragon 810, albeit a revised and clocked version which doesn’t overheat, and yet retains speedy performance.