Qualcomm reveal at MWC in March that will release a new chipset, the Snapdragon 820. However, since that date they just reveal a few little things about it.
But now there is a new rumor about this upcoming chipset. It seems that Qualcomm will unveil the full details of the Snapdragon 820 next week, on August 11, in Los Angeles.
So far we just know that the Snapdragon 820 will use Kyro cores, custom designed by Qualcomm. It will also have a quad-core CPU, the Adreno 530 GPU, the MDM9x55 LTE Cat.10 modem, and will be made on a FinFET process – either Samsung’s 14nm or TSMC’s 16nm.
As you may remember, the 810 has several overheating problems, so device makers everywhere are anxiously waiting for the 820. This will probably power some smartphones at the end of the year or at the beginning of 2016.